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CMP / Polishing machine
R&D CMP Tool
MAT provides systems for R&D CMP tool with both Manual version and Automatic
version. The equipments feature from one chip size up to 12”dia. to fit customer’s
specific needs. See the table below.
For the equipment or specific substrate sizes and forms other than the listed-up please feel free to contact us.
R&D CMP tool for
200mm wafer
200mm wafer
R&D CMP tool for
300mm wafer
300mm wafer
Automatic R&D CMP tool for 200mm wafer
R&D CMP tool for small wafer size
Table top CMP tool
CMP Wafer Polishing System
MAT’s CMP Wafer polishing system model features various wafer sizes same as a system for the R&D. Also for the customer’s requirements our engineering experts support from system configurations to processes arrangement according as the customer’s budget so to provide the system with the stable and hi-cost performance.
Full-Automatic Si-Wafer Polishing System
Si-Wafer Full-automatic
Polishing System
for Mass-Production
Polishing System
for Mass-Production
Small-Wafer Full-automatic
Polishing System
for Mass-Production
Polishing System
for Mass-Production
Full Automatic CMP
system for MEMS
system for MEMS
Manual Polishing
System for SiC wafer
mass production
System for SiC wafer
mass production
Full Automatic
Polishing System for 300mm wafer
Polishing System for 300mm wafer
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