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CMP（Chemical Mechanical Planarization）
CMP(Chemical Mechanical Planarization) is an indispensable process for Semiconductor’s highly-multi-layer processes. In early stage the planarization of inter-layers-insulation-film was its main purpose. Recently however shaping or planarization of the wiring such as Cu-Damascene process has become the main purpose.
An example of inter-layers-insulation planarization
An example of Cu-Damascene process
As CMP process gets popular it tends to be demanded for other than Semiconductor device processes. MAT Inc. is going to offer various kinds of planarization process technology with CMP as the core to such various kinds of customer’s request. Further we have expertise for handling unique kind of films or small sized and uniquely formed substrates.
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Category |
Contents |
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Semiconductor |
・ILD, STI, W, Cu damascene process ・Low-K material evaluation ・Consumables development & evaluation such as Slurry, Pad, and Conditioner ・TSV |
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SiC |
・Super-surface-finish CMP |
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MEMS |
・TSV ・Insulation layer planarization, Sacrifice layer planarization, etc. |
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FPD |
・ITO surface-finish, Resin-film planarization and etc. |
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PCB |
・Circuit print layer, Insulation layer and etc. |
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Others |
・Miscellaneous substrate, Oxidized film, Metal film planarization, Surface-finish |
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