Product > CMP R&D System

Manual Loading CMP System	CMP R&D system for 300mm	MEMS CMP System	Dru-In/Wet-Out CMP System
Dry-In/Dry-Out CMP System	300mm/200mm Wafer automatic CMP System	The Desk Top CMP R&D System

	Includes 200mm head and dress axis Minimum foot print in this class Easy operation by TFT color touch panel
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	CMP R&D system for 300mm The wafer of φ8" or less can correspond by the head exchange. Sweep Dress of zone control Pad Profile can be taken. The demonstration test is possible. 300mm 200mm Max.Load Spindle Max.RPM Platen Max.RPM 7psi 60rpm 60rpm 10psi 100rpm 100rpm
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	For diversified MEMS process requirement, MAT designed special CMP tool. New designed carrier can applied extremely low down force control. The detail specification will be determined based on customer's requirement. Up to 6" Wafer. Special low down force control by new designed carrier. 10 recipes storage. Switchable conditioner layout Small footprint Customized set up is available.
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	Dry-In/Wet-Out φ200mm Head+Scanning Dress Axis Individual Recipe can be set on each wafer Customized system set up is available (Ex. Multiple Slurry System, Drain valve,Small wafer or Square wafer set up) 200mm Max.Load Spindle Max.RPM Platen Max.RPM 7psi 120rpm 120rpm
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	Built-In Scrub Cleaning System Dry-In/Dry-Out φ200mm Head+Scanning Dress Axis Individual Recipe can be set on each wafer Customized system set up is available (Ex. Multiple Slurry System, Drain valve, Small wafer or Square wafer set up) 200mm Max.Load Spindle Max.RPM Platen Max.RPM 7psi 120rpm 120rpm ← You can see VTR
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	Dry-In/Wet-Out 300mm Head+200mm Head+Dressing Axis Easy dummy polishing with 200mm wafer for 300mmCMP Experiment Individual Recipe can be set on each wafer Customized System set up is available (Ex. Multiple Slurry System, Drain valve, Small wafer or Square wafer set up) Semi-Auto syatem Loading by hand 300mm 200mm Max.Load Spindle Max.RPM Platen Max.RPM 7psi 80rpm 80rpm 10psi 100rpm 100rpm
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	The most basic desk-top type CMP R&D System. A desk-top CMP machine of other sample machine bases is a high rigidity that makes a clear distinction. An experiment near the mass production device is possible according to various options. It is domination in the cost performance. An open type is possessed. The demonstration test is possible.
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