Product ＞ Wefer Polishing Machine       ■Fully　automatic wafer back-side polishing mashine(Dry-In/Dry-Out) ■Minimum foot print for the optimum space factor For   "Through the wall"design ■For φ4"φ5"φ6"andφ8"wafer polishing ■Higher through put by 2heads layout           ⇒Partial details               ▲TOP         ■CMP device that had highly accurate processing and 　mass production of φ8"bulk silicon wafer   ▲TOP   English HOME