MAT's grinding machines provide the systems from the R&D use to mass production. We will propose the process from the system configuration to the consumable selection by our considerable experience.
The system of manual grinding for 8” and 12” wafer size
The Hi-Performanced grinding system for the large substrate.
Grinding and polishing system for 12” wafer back-off.
Full-automatic grinding system for 4" to 8” wafer size for higher TTV control.