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MAT Inc. has expertise of CMP process for Semiconductor Application such as Planarization, Planeing and Super Surface Finishing.
What's New?
隼 MAT BGP1
隼 MAT BGP1
The ultimate weapon for LED sapphire wafer back off.
MAT GYR-823A
MAT GYR-823A
High accuracy,
valve price water back grinder
valve price water back grinder
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2011.01.19～21 |
3rd LED/OLED Lighting Technology Expo. (LIGHTING JAPAN) In joint booth 3-5 West Hall Toyota Tsusho Co. & MAT Inc. |
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July 28～30 /2010 |
At the 21st Micro Machine Exhibition received a large number of visitors. |
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July/2010 |
July 28～30 At the 21st Micro Machine Exhibition at Tokyo Big Site Booth E12. Open AN10:00～PM5:00 |
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June/2010 |
Used machines such as CMP tool, post-CMP Cleaning tool will be available for sale.please contact us for more information. |
MAT provides key technologies in the fields of Polishing and Grinding for such as Planarization, Mirror-surface finishing, wafer thinning.
MAT Inc. Collaborates with the customer for thier Research and Development offering the process design through the custom equipment design for Planarization, Mirror-surface-finishing and Chip-thinning in Semiconductor, MEMS and various other fields.
Your concerns on device will be gone!
Agreat step toward your nest generation device!
Agreat step toward your nest generation device!
MAT stands ofr Machine, Application and Tools
Machine：
Provides customized design of a desk top R&D tool trough mass production system for CMP, Grinding and Cleaning processes and manufacture them.
Application：
●Develops the grinding and CMP processes for Power devices such as SiC and Silicon wafer based and for other most advanced devices such as Semiconductor or Micro Machines(MEMS).
●CMP before wafer bonding/pre wafer bonding process/pre process/
pre treatment of wafer bonding
●Offers Evaluation test for development of Pad, Slurry, Cleaning material, Grindstone and etc.
●Provides lapping process service for such as plane reforming of Platen which requires precision plane and surface finish. Contact us for more details.
Tools：
Provides various consumables for such as polishing ( Pad, Cloth ),Slurry (Compound) Cleaning chemicals, Grinding wheel, diamond conditions and etc.
MAT's technologies are further applied in the fields such as PC, Portable telephone, ETC, Games and etc. which are growing day by day applying the cutting edge processes.
MAT recently is focusing on Solar battery field and LED use Sapphire process as well.
Please feel free to contact us regardless of what product field you are in.
Machine：
Provides customized design of a desk top R&D tool trough mass production system for CMP, Grinding and Cleaning processes and manufacture them.
Application：
●Develops the grinding and CMP processes for Power devices such as SiC and Silicon wafer based and for other most advanced devices such as Semiconductor or Micro Machines(MEMS).
●CMP before wafer bonding/pre wafer bonding process/pre process/
pre treatment of wafer bonding
●Offers Evaluation test for development of Pad, Slurry, Cleaning material, Grindstone and etc.
●Provides lapping process service for such as plane reforming of Platen which requires precision plane and surface finish. Contact us for more details.
Tools：
Provides various consumables for such as polishing ( Pad, Cloth ),Slurry (Compound) Cleaning chemicals, Grinding wheel, diamond conditions and etc.
MAT's technologies are further applied in the fields such as PC, Portable telephone, ETC, Games and etc. which are growing day by day applying the cutting edge processes.
MAT recently is focusing on Solar battery field and LED use Sapphire process as well.
Please feel free to contact us regardless of what product field you are in.
Contact us
Contact us at:
Sales Department, MAT Inc.
TEL: +81-3-5914-6355
FAX: +81-3-5914-6356
Sales Department, MAT Inc.
TEL: +81-3-5914-6355
FAX: +81-3-5914-6356
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