隼（ＨＡＹＡＢＵＳＡ）
GYR-823A


◇東京都経営革新優秀賞　奨励賞」を受賞しました。

◇中古装置販売中

◇3インチサファイアウェハー販売中

◇New　Machine　MATUHK-541A　受賞しました

◇板橋青年優秀技能者賞

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MEMS application

  Based on our good results from Semiconductor CMP the application of MAT system for MEMS is growing rapidly. Other than ordinarily featured equipment we offer small wafer use equipment and a custom designed equipment to cope with unique requirements of MEMS and CMP devices.  As our specialty we have great deal of process truck record regarding TSV wafer which is an interposer for WLP needs and regarding planarization CMP the prior process to bonding substrates together.

An example of TSV-CMP
An example of TSV-CMP

An example of TSV-CMP Chip thinning
An example of TSV-CMP Chip thinning

For MEMS application various kinds of materials need to be adopted. While MAT has variety of experiences those experiences from various test results or customers’ demands are reflected into the equipment design.
　
Materials of our process truck record
●Many results　　○Customized process available to propose　　▲Under study
Material
 Grinding
 Lapping(diamond)
 CMP
SiC
 ○
 ●
 ○
Si
 ○
 ●
 ●
GaAs
 ○
 ●
 ○
GaP
 ○
 ●
 ○
GaN
 ○
 ●
 ○
SiO2
 ○
 ●
 ●
Photo resist
 ●
 ●
 ●
Glass
 ●
 ●
 ○
Sapphire
 ○
 ●
 ●
Ceramics
 ○
 ●
 ●
Cu
 ▲
 ▲
 ○
W
 ○
 ○
 ●
Al
 ▲
 ▲
 ●
Au
 -
 ▲
 ○
Ag
 ▲
 ▲
 ○
MgZin
 ○
 ○
 ○
Ta
 ○
 ○
 ●
TiN
 ○
 ○
 ●
Al2O3
 ○
 ○
 ●
NiFe
 ▲
 ▲
 ●

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