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Producing the sample for defect analysis
We have the tools to aim at the IC device observation of the surface and the cross section necessary for the quality inspection. Making the quality inspection sample to shorten time greatly brings to fruition, as a result that the conventional resin molding is unnecessary by the method of maintaining an original sample. In addition, we offer a high surface quality by applying the knowhow of CMP.
Di-layer for chip analysis
Cutting and Polishing system for IC-package
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