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Foundry service
■ Process test and foundry service
MAT Inc. provides a total solution of Process development, design and foundry service. We can control the number of the sample depend on the customer's request.
Grinding service
■ Wafer thinning by grinding
MAT Inc. provides a thinning process (max dia. is 300 φ) by the high performance grinding machine. We can control the final thickness for customer’s request from the mirror surface finishing by grinding
through the polishing surface and cleaning.
Material evaluation
■ Consumable material evaluation
MAT Inc. evaluates the slurry, pad, cleaning chemical, grinding wheel and support the process arrangement after the testing in real time.
Sample materials
■ Sample material for the development device
MAT Inc. provides a sample device production service by planarization.

Case1:Damascene process

Case2: Planarization of the insulator of TSV

Case3 :Planarization of the metal

Case4: Improvement of the surface roughness
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Type |
Brand |
Model |
Wafer size |
Function |
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Processing machine |
CMP R&D system |
MAT |
MAT ARW-681MKⅡ |
4,5,6,8 |
100mm dia.Sweep or for Large wheel use |
|
MAT |
MAT BC-15C |
chip 4,5,6 |
Desktop type |
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|
MAT |
MAT ARW-8C1MS |
MAX 300mm dia. |
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Grinder R&D system |
MAT |
MAT GYR-311MA |
MAX 300mm dia. |
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Defects sampling machine for analysis |
MAT |
MAT Polish Analyzer |
Chip |
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MAT |
MAT X-Section Analyzer |
Chip |
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Cleaning system |
Cleaning R&D system |
MAT |
MAT ZAB-8S1M |
~8 |
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MAT |
MAT SPN-8M |
8 |
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Measuring instrument |
Metal thickness meter |
NAPSON |
RT-80 RG-120 |
~12 |
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Profiler |
KLA Tencor |
P16 |
~8 |
tracer 2μm & submicron |
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Thickness meter for wafer |
ADE |
ULTRA GAGE 9500 |
4,5,6,8 |
Auto loader included |
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Optical microscope |
OLYMPUS |
BH2-UMA |
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Inspection light source |
HAYASHI |
LA-150TX |
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Laser microscope |
KEYENCE |
VK-8500 |
~8 |
3-D form measurement |
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Height gage |
Nikon |
MF1001 |
~ around 12 |
resolution 0.1μm |
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Optical surface profiler |
Canon |
Zygo New View200 |
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Optical thickness meter |
MAT |
MOEGI |
~8 |
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