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Cutting and Polishing system for IC-package
◆Compact foot print by the specially designed.
■Applying the Si wafer, the package substrate, and the print substrate.
■Most suitable for the checking the disconnection between the layers
■No need to solidify with a resin
■Enabled the process from cutting to polishing by changing tools
■Applying the Si wafer, the package substrate, and the print substrate.
■Most suitable for the checking the disconnection between the layers
■No need to solidify with a resin
■Enabled the process from cutting to polishing by changing tools
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Specification |
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RPM range |
2000～20000rpm (3mm dia. movable collet) |
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Foot print |
W331xD312xH612mm |
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Microscope |
x10～x40 LED light with 3 objective lenses(enabled mounting the camera) |
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Table |
X/Y mortalized stage(stroke 25mm) |
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Power |
AC100V |
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touch Panel |
4.7" Black-and-white vision |
MAT X-Section Analyzer
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