Kemet Japan Co., Ltd.

Please contact us if you are interested in CMP or wafer thinning process for semiconductor devices, brittle material, amorphous material, thin film, metal etc.


BC-15CNTable top CMP available from chip size up to 6 inch wafer

*Basic structure
*High rigidity
*Good cost performance
*Safety cover is equipped
*Demonstration is available


Kemet Japan Co., Ltd. can propose fine planarization; minimize surface profiling and thinning for next generation device with a lot of experience and unique technology.
Kemet Japan Co., Ltd. can provide test service for not only semiconductor but also SiC, GaN, MEMS, fine ceramics, LED, sapphire, organic EL etc.
The customer’s requirement such as target accuracy, through put, process steps, and budget will be discuss to promote the solution.
Kemet Japan Co., Ltd. also can propose test service for the development of consumable material such as polishing pad, polishing slurry, chemical cleaning, and grinding wheel.
For the equipment maintenance, we can offer the highly quality of flatness for platen, CMP head, and substrate using accurate lapping systems.


Company name Kemet Japan Co., Ltd.
President Satoshi Takikawa
Head office
Technical Lab1
Nakase Mihama-ku, Chiba City 2-6 WBG Malibu West 21F
TEL +81-43-213-9911
FAX +81-43-213-9932
Established June 2002
Capital stock 32,000,000
Business Machine design and sales(Lapping and Polishing machine, Automated systems, Inspection system)
Lapping and polishing tools design and sales.
Consumable items for Lapping and Polishing sales.
Lapping and Polishing services.