MAT Inc.

Please contact us if you are interested in CMP or wafer thinning process for semiconductor devices, brittle material, amorphous material, thin film, metal etc.


BC-15CNTable top CMP available from chip size up to 6 inch wafer

*Basic structure
*High rigidity
*Good cost performance
*Safety cover is equipped
*Demonstration is available


MAT Inc. can propose fine planarization; minimize surface profiling and thinning for next generation device with a lot of experience and unique technology.
MAT Inc. can provide test service for not only semiconductor but also SiC, GaN, MEMS, fine ceramics, LED, sapphire, organic EL etc.
The customer’s requirement such as target accuracy, through put, process steps, and budget will be discuss to promote the solution.
MAT Inc. also can propose test service for the development of consumable material such as polishing pad, polishing slurry, chemical cleaning, and grinding wheel.
For the equipment maintenance, we can offer the highly quality of flatness for platen, CMP head, and substrate using accurate lapping systems.


Company name MAT Inc.
President Tsukasa Nakahara
Head office
Technical Lab1
3-22-7 Hasune, Itabashi-ku, Tokyo 174-0046 JAPAN
TEL +81-3-5914-6355
FAX +81-3-5914-6356
Established September 1998
Capital stock \10,000,000
Business Machine design and sales(Lapping and Polishing machine, Automated systems, Inspection system)
Lapping and polishing tools design and sales.
Consumable items for Lapping and Polishing sales.
Lapping and Polishing services.