- BC-15CNTable top CMP available from chip size up to 6 inch wafer
*Good cost performance
*Safety cover is equipped
*Demonstration is available
MAT Inc. can propose fine planarization; minimize surface profiling and thinning for next generation device with a lot of experience and unique technology.
MAT Inc. can provide test service for not only semiconductor but also SiC, GaN, MEMS, fine ceramics, LED, sapphire, organic EL etc.
The customer’s requirement such as target accuracy, through put, process steps, and budget will be discuss to promote the solution.
MAT Inc. also can propose test service for the development of consumable material such as polishing pad, polishing slurry, chemical cleaning, and grinding wheel.
For the equipment maintenance, we can offer the highly quality of flatness for platen, CMP head, and substrate using accurate lapping systems.
|Company name||MAT Inc.|
|3-22-7 Hasune, Itabashi-ku, Tokyo 174-0046 JAPAN|
|Business||Machine design and sales(Lapping and Polishing machine, Automated systems, Inspection system)
Lapping and polishing tools design and sales.
Consumable items for Lapping and Polishing sales.
Lapping and Polishing services.