MAT provides systems for R&D CMP tool with both Manual version and Automatic version.
The equipments feature from one chip size up to φ300mm dia. to fit customer’s specific needs.
See the table below.
For the equipment or specific substrate sizes and forms other than the listed-up please feel free to contact us.

R&D CMP Tool

• BC-15CN Table top CMP available from chip size up to 6 inch wafer
• ARW-461M R&D CMP tool for small wafer size
• ARW-681MSⅡ R&D CMP tool for 200mm wafer
• ARW-8C1MS R&D CMP tool for 300mm wafer

CMP for mass production

• UHK-8C31M Manual Polishing System for SiC wafer mass production
• UHK-963A Full Automatic Polishing System for 300mm wafer
• UHK-541A Full Automatic CMP system for MEMS
• ARW-681A Automatic R&D CMP tool for 200mm wafer

Grinding equipment

• GYR-211・311MA The system of manual grinding for φ200mm and φ300mm wafer size
• GYR-823A φ4、6、φ200mm fully automatic Back grinder
• GYR-182AS Full-automatic grinding system for 4" to φ200mm wafer size for higher accuracy TTV control.

Cleaning equipment

• ZAB-8S1M Single side cleaning system for φ200mm wafer
• ZAB-8W3AS Full-Automatic double side cleaning system for exclusive φ200mm wafer
• ZAB-8C5A Full-Automatic double side cleaning system for φ200mm and φ300mm wafer

Lapping equipment and other

• UHK-840-4F Single side lapping system for SiC wafer
• UHK-1250-4N Single sided polishing system for sapphire wafer
• MGR-380F The lapping system with facing unit